Applied Materials Centura 5200 DPS System
This piece of used equipment is surplus and is immediately available for purchase.Make:
Applied Materials
Model:
Centura 5200 DPS
Quantity:
8
Configuration and Description:
PolySilicon Etch Equipment System
Configured for 200 mm wafer sizes - (SNNF)- Single Notch No Flat
Applied Materials 2 Chamber DPS R.1 Poly Etcher
Software Version : E3.7
Short Controller
Wide Body load locks - with Auto Rotation
Heated Loadlocks - with N2 purge
Wafer Mapping
Wafer on Blade Detector - Basic
Robot Type : HP+
Monochromator Endpoint / HOT Pack Endpoint : ENDP30 Software
Secondary 4 Channel PCB
Chamber Position F : Orientor (OA)
Chamber Positions : A, B - DPS Poly R.1
- Electrostatic Chuck
- Backside He Cooling
- Slit Valve
- RGA Port
- Chamber Rough Line
- Seiko Seiki Turbo Pumps : STP-A2203-PV
- IEP 365
Neslab HX-150 for Cathode
Neslab Steel Head for Wall
AE : RF5S / RF20R RF Generators
Gas Panel and Gas Layout :
10 Gas Line positions per Pallet / Horizontal Purge Manifold
Valve Type : Veriflo
Filter Type : Millipore
Transducer Display Type : MKS
MFC Type : Unit 1661
Facility Lines/ Gas Lines :
Gas Panel Layout for Chambers A, B :
Position Size Gas :
1 100 CL2
2 200 AR
3 20 O2
4 300 HBR
5 200 SF6
6 100 O2
7 20 N2
8 100 CF4
9 20 HE/O2
10 200 HE
Single Line Drop Feed, A/C, Bottom
Phase II 10ra Regulated - Facilities Type
Bottom Facilities Connection
Vacuum Pumps not included with Sale
Crated and Stored




