Applied Materials Centura 5200 DPS System

This piece of used equipment is surplus and is immediately available for purchase.
  • Submit An Enquiry or email us at team@evensale.com
  • Make: 
    Applied Materials
    Model: 
    Centura 5200 DPS
    Quantity: 
    8
    Configuration and Description: 

     

    PolySilicon Etch Equipment System
    Configured for 200 mm wafer sizes - (SNNF)- Single Notch No Flat
    Applied Materials 2 Chamber DPS R.1 Poly Etcher 
    Software Version : E3.7 
    Short Controller 
    Wide Body load locks - with Auto Rotation 
    Heated Loadlocks - with N2 purge 
    Wafer Mapping 
    Wafer on Blade Detector - Basic 
    Robot Type : HP+ 
    Monochromator Endpoint / HOT Pack Endpoint : ENDP30 Software 
    Secondary 4 Channel PCB 
    Chamber Position F : Orientor (OA) 
    Chamber Positions : A, B  - DPS Poly R.1 
    •  Electrostatic Chuck 
    •  Backside He Cooling 
    •  Slit Valve 
    •  RGA Port 
    •  Chamber Rough Line 
    •  Seiko Seiki Turbo Pumps : STP-A2203-PV 
    •  IEP 365 
    Neslab HX-150 for Cathode  
    Neslab Steel Head for Wall 
    AE : RF5S / RF20R RF Generators 
    Gas Panel and Gas Layout : 
    10 Gas Line positions per Pallet / Horizontal Purge Manifold 
    Valve Type : Veriflo 
    Filter Type : Millipore 
    Transducer Display Type : MKS 
    MFC Type : Unit 1661 
     
    Facility Lines/ Gas Lines : 
    Gas Panel Layout for Chambers A, B : 
    Position       Size      Gas  : 
    1              100       CL2 
    2              200       AR 
    3              20        O2 
    4              300       HBR 
    5              200       SF6 
    6              100       O2 
    7              20        N2 
    8              100       CF4 
    9              20        HE/O2 
    10             200       HE 
     
    Single Line Drop Feed, A/C, Bottom 
    Phase II 10ra Regulated - Facilities Type 
    Bottom Facilities Connection 
    Vacuum Pumps not included with Sale 
    Crated and Stored